AutoCAD Training : Autodesk Simulation Moldflow Insight 2015 Underfill Encapsulation

The Underfill Encapsulation with Autodesk Simulation Moldflow Insight 2015 training material discusses the underfill encapsulation process used in the electronics industry. Discussions include an overview of the underfill encapsulation process and material, and simulating underfill.

AutoCAD Training Topics

Underfill encapsulation overview

Simulating underfill encapsulation molding

Underfill encapsulation materials

Prerequisites

This training manual assumes knowledge of Autodesk Simulation Moldflow Insight, including CAD Model importing, and meshing. Refer to the guide Autodesk Simulation Moldflow Insight Fundamentals for more information on these subjects.

AutoCAD Training Course Duration

6 hours

AutoCAD Training Course outline

Chapter 1 Underfill Encapsulation Molding Overview

Chapter 2 Simulating Underfill Encapsulation Molding

Chapter 3 Underfill Encapsulation Material

Chapter 4 Underfill Encapsulation Practice

Appendix A Glossary

Appendix B Calculation of Shape Factor in Flip Chip Analysis

Please contact your training representative for more details on having this course delivered onsite or online

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