AutoCAD Training : Autodesk Simulation Moldflow Insight 2015 Microchip Encapsulation

The Microchip Encapsulation with Autodesk Simulation Moldflow Insight 2015 training material discusses the simulations capabilities involving microchip encapsulation. The course emphasizes the modeling, setup and results interpretation of the various analyses that can be done. The exercises relate to the skills necessary to perform the needed analyses.

AutoCAD Training Topics

Microchip encapsulation molding overview.

Modeling wires for microchip encapsulation.

Modeling paddles for microchip encapsulation.

Model assembly for microchip encapsulation.

Analysis setup for microchip encapsulation.

Compression molding with wire sweep.

Results interpretation of microchip encapsulation analyses.

Prerequisites

This training manual assumes knowledge of Autodesk Simulation Moldflow Insight, including CAD Model importing, and meshing. Refer to the manual Autodesk Simulation Moldflow Insight Fundamentals for more information on these subjects.

AutoCAD Training Course Duration

8 hours

AutoCAD Training Course outline

Chapter 1 Microchip Encapsulation Molding Overview

Chapter 2 Simulating Microchip Encapsulation Molding

Chapter 3 Modeling Wires for Microchip Encapsulation Analysis

Chapter 4 Modeling Paddles for Microchip Encapsulation Analysis

Chapter 5 Model Assembly for Microchip Encapsulation Analysis

Chapter 6 Analysis Setup for Microchip Encapsulation Projects

Chapter 7 Results Interpretation of Microchip Encapsulation Analysis

Chapter 8 Compression Molding with Wire Sweep

Appendix A Glossary

Please contact your training representative for more details on having this course delivered onsite or online

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